As the semiconductor industry continues to develop, advanced packaging technology has become the focus of the industry.
In 2026, there will be new and important developments in this field.
TSMC revealed at the first quarter 2026 performance briefing that it is building a pilot production line for CoPoS advanced packaging technology and is expected to enter the mass production stage in a few years.
This news has attracted widespread attention in the industry.
At the same time, according to relevant reports, Samsung Electro-Mechanics has officially provided Apple with glass substrate samples for semiconductor packaging.
Advanced packaging technology is accelerating iteration, and the corresponding substrate material is expected to develop toward glass substrates.
Let’s sort out the relevant industry chains and enterprise situations.
In terms of the advanced packaging CoPoS technology industry chain, TSMC, as a global wafer manufacturer, actively promotes the construction of pilot production lines for CoPoS advanced packaging technology, demonstrating its layout and determination in the advanced packaging field.
Han’s Laser is mainly engaged in the research and development, production and sales of laser processing equipment, and can provide ultra-fast laser equipment required for advanced packaging and processing links.
Changchuan Technology is mainly engaged in the research and development, production and sales of semiconductor testing equipment and packaging equipment, which can cover the supply of equipment related to advanced packaging links.
In the semiconductor packaging glass substrate industry chain, Samsung Electro-Mechanics is engaged in the manufacturing of electronic components and the supply of semiconductor packaging substrates. It sent sample glass substrates to Apple, taking an important step for the application of glass substrates in the field of semiconductor packaging.
Dongxu Optoelectronics is mainly engaged in the R&D and production of optoelectronic display glass substrates, photovoltaic glass and other products, and has the R&D and production capabilities of glass substrates for semiconductor packaging.
Ancai Hi-Tech focuses on the R&D and production of glass substrates, photovoltaic glass and other fields, and can carry out business related to semiconductor packaging glass substrates.
There is also a lot of discussion in the market about these new developments.
Some investors believe that Samsung Electro-Mechanics is progressing very quickly in sending glass substrate samples to Apple, while TSMC is making progress in setting up a pilot production line, but mass production will still take several years, and the progress seems to be half a beat slower.
Some people also think that manufacturers of related supporting equipment may be able to reap dividends, and companies that develop glass substrates and related equipment may have many opportunities in the future.
Some people also expect that after the popularity of glass substrates, packaging performance will reach a higher level. If Apple adopts it, the popularity may accelerate.
In addition, some people are paying attention to the characteristics of glass substrates. For example, glass has a stronger thermal conductivity than resin. They speculate that if glass substrates become popular, mobile phone heat dissipation may be better, but they are also worried about its cost.
In short, the development of advanced packaging technology and the application prospects of glass substrates deserve continued attention from the industry and investors.
