As smart homes and smart home appliances accelerate their evolution towards interconnection, innovation of underlying core components has become the core driving force for industrial upgrading.
Yuanengxin 2026 (Zhongshan) Smart Home Appliances and Smart Home Technology Seminar will be held on July 24, 2026 in the Daxin Banquet Hall on the third floor of Dasin Hotel (Xiaolan Branch), Zhongshan, Guangdong.
This seminar is dedicated to connecting chip original manufacturers, component suppliers and smart home terminal manufacturers in series to build an efficient communication field to face engineering problems.
It will deeply dissect the cutting-edge implementation paths of smart home appliances and whole-house intelligence, and conduct practical discussions around core underlying devices and key technologies such as new-generation intelligent control and wireless interconnection chips, low-power multi-mode sensing modules, high-energy-efficiency motor drives and power management solutions, and software and hardware collaborative development platforms.
At the same time, front-line technical experts will provide a dismantling interpretation of the consistency issues of device interconnection, system firmware security, and long-term operation stability.
The on-site special program new product exhibition area and supply and demand matchmaking meeting focus on inviting the R&D backbones, procurement and supply chain leaders of terminal manufacturers to accurately match the business decision-making levels and FAE teams of upstream semiconductor and high-end component companies.
Whether it is model selection, BOM optimization or customized technical support, one-stop docking can be achieved on site, accelerating the process from product design to implementation.
This seminar has many highlights.
The plans are displayed in a centralized manner to present innovative results.
A display area for core devices and solutions has been set up on site to focus on displaying the latest “core” smart home products.
The company will bring integrated MCUs, the latest power MOS tubes, power management ICs and advanced test solutions to provide developers with one-stop procurement and technical support.
Accurately connect supply and demand and connect industrial resources.
A special supply and demand communication link is set up to build a direct dialogue platform for terminal manufacturers and upstream chip and solution suppliers.
R&D and procurement personnel can conduct efficient consultations with original product managers and technical support teams on issues such as device selection, parameter customization, and supply assurance to achieve accurate matching of key resources and long-term cooperation.
The exclusive report is first released to provide reference for decision-making.
During the summit, the latest smart home industry research report will be released. The report will provide in-depth analysis from multiple dimensions of smart home market size, competition landscape, consumer behavior analysis and future trends. Based on big data and in-depth research, it will provide quantitative reference for participants to formulate technical routes and market planning, and accurately locate the next growth point.
Focus on the pain points of implementation and accelerate technology iteration.
The smart home industry is evolving rapidly and faces many challenges from solution design, technology iteration to large-scale implementation.
This seminar is based on R&D, selection and mass production practices, abandons empty concepts, and systematically shares proven development frameworks, reusable module solutions and testing methodologies, helping companies shorten the conversion cycle from prototypes to products and seize opportunities in technology iterations.
Specially invited experts share and deconstruct technical paths.
The conference specially invited senior technical experts and benchmark company decision-makers in the field of smart home to provide in-depth and forward-looking interpretations on technical directions such as multi-ecological interconnection architecture, end-side intelligent deployment, high-efficiency drive and power management.
The shared content focuses on technology selection and architecture pre-research, providing participants with reference value for evolution ideas and decision-making basis.
The topics cover smart home AI algorithms and future trends, the integration of the Internet of Things (IoT) and home appliance intelligent control, air conditioning control power supply, miniaturization of home appliance power modules, high-integration design trends, home appliance lighting two-in-one power supply, end-side AI and GenAI lighting smart body applications, home appliance motor silence and reliability, ultra-thin high-density motor +
Silent air duct technology upgrade, fan and light integrated intelligent drive, constant current and constant voltage integrated drive, high integration trend of home appliance main control, new lighting technology and domestic and foreign indoor lighting standards, home appliance EMC/EMI design difficulties and interpretation of compliance standards, dimming and color matching and intelligent lighting control, etc.
R&D engineers, procurement and decision-makers from upstream and downstream of the industry chain who are interested in participating in this seminar can sign up and enter the relevant platform to fill in the information.
I believe that this seminar will jointly promote the innovation and upgrading of the smart home appliance industry through the collision of top ideas and one-stop docking.
