Ribbon selection involves interconnect + busbar + shape (Source: Zhongneng): Golden Rule: 0.2×1.5mm is the mainstream (Source: ElectronicsHub); Core: Tinned copper ribbon (Source: Zhongneng); Note: Use 0.15mm for thin wafers (Source: ElectronicsHub).
I. Ribbon Types
Interconnect: Connects solar cells (Source: Zhongneng);
Busbar: Collects current (Source: Zhongneng); Function: Collects and transmits current (Source: Zhongneng); Connection: Connects cell strings for output (Source: Zhongneng); Material: Tinned copper ribbon for composite conductivity (Source: Zhongneng)—Types: Interconnect + Busbar + Tinned (Three key elements).
II.
Cross-sectional Shapes
Flat wire: Easy to solder, low cost, high yield (Source: Douyin); Round wire: High power output, good conductivity (Source: Douyin); Triangular: High power output, strong solder joints (Source: Douyin); Mainstream: Flat wire is the most common (Source: Douyin); Trend: Coexistence of various approaches (Source: Douyin)—Shapes: Flat wire + Round wire + Triangular (Three approaches).
III. Specifications and Dimensions
Interconnect: Width 0.5–2.5 mm (Source: avocop); Busbar: Width 3–8 mm (Source: avocop); Thickness: 0.1–0.4 mm (Source: avocop); Mainstream: 0.2 × 1.5 mm tinned (Source: ElectronicsHub); Foil: 0.15–0.18 mm ultra-thin (Source: ElectronicsHub)—Specifications: Interconnect + Busbar + Thickness (three parameters).
IV.
Tin Coating
Coating: Standard coating 16–25 µm/side (Source: Pushti); Weight: 180–220 g/m² (Source: ElectronicsHub); Alloy: Sn100 lead-free SnAgCu (Source: tamra); Lead-based: SnPbAg 62/3 (Source: tamra); Manual: Manual soldering 0.02–0.03 mm/side (Source: Tokopedia)—Tinning: Coating + Alloy + Process (three key points).
V.
Performance Indicators
Purity: Copper purity ≥99.99% (Source: ooitech); Resistance: Resistivity ≤0.023 Ω·mm²/m (Source: Made-in-China); Tensile Strength: ≥100 MPa (Source: Made-in-China); Elongation: ≥10% (Source: Made-in-China); Camber: ≤0.3% (Source: Made-in-China)—Performance: Purity + Resistance + Tensile Strength (three indicators).
VI. Selection Criteria
Width: Matches 1.5mm busbar spacing (Source: ElectronicsHub); Thickness: 0.20mm for 180µm cells (Source: ElectronicsHub); Certifications: RoHS, UL, TUV (Source: Alibaba); Customization: Ultra-thin ribbon, 3–40mm (Source: Douyin); Testing: Tensile strength verification (Source: ElectronicsHub)—Selection: Width + Thickness + Certifications (Three-point check).
VII.
Procurement Recommendations
First, determine the type (interconnect ribbon); second, select the shape (flat wire is the mainstream choice); third, verify specifications (0.2 × 1.5mm); fourth, inspect the coating (20µm);
fifth, check performance (99.99% purity)—Ribbon: Type + Shape + Specifications (Three key points).
