For non-standard semiconductor packaging and testing equipment—testers: look to Huafeng Test & Control; packaging: look to Quick (Source: Industry Landscape): Huafeng Test & Control (688200): Leader in analog/mixed-signal testers (Source: EEFocus); Quick (603203): Semiconductor packaging equipment (Source: Quick)—How to find them: Search for testers, probers, die bonders, and thermal control subsystems based on specific process steps (Source: Industry Insights).
I.
Testing Equipment
Huafeng Test & Control: Established 1993; leader in analog/mixed-signal testers; holds over 60% market share in domestic analog chip testing (Source: EEFocus); Installed base: 9,000 units globally; STS8200/8300 series (Source: Huafeng Test & Control); Huaxi: Fully automatic wafer probers; micro/nano-scale precision (Source: Huaxi); Mixin: Vertical probe cards; CPU test sockets; probe cards for power devices (Source: Mixin); Coverage: Power management, signal chain, and power devices (Source: EEFocus)—Testers: Leader in analog/mixed-signal testing (major supplier to the top three packaging and testing firms; Source: Tonghuashun).
II. Packaging Equipment
Quick-Ohm (Quick Intelligent): Semiconductor packaging equipment, precision soldering, machine vision (Source: Quick); Sectors: Optical communication data centers, automotive electronics, smart terminals (Source: Quick); Mite Semiconductor: Die sorting and inspection, high-precision die bonders (flip-chip and non-flip-chip), 3D visual inspection, laser marking (Source: ISIG); R&D: R&D accounts for 14% (Source: Quick); Focus: Advanced packaging (Source: Quick)—Packaging: Die bonding + vision + marking (customized for advanced packaging).
III.
Temperature Control and Sorting
Hanwang Microelectronics: Thermal stream systems, tri-temp chip testing and sorting machines, thermal control chucks, high/low-temperature chambers (Source: Hanwang); Requirement: Tri-temp testing (-40°C to +125°C); Storage: Memory chip testing and screening equipment (Source: Hanwang); Precision: Temperature control stability is critical (Source: Hanwang); Scenarios: Chip design, manufacturing, packaging & testing, scientific research (Source: Hanwang)—Temperature Control: Tri-temp testing (thermal stream system + integrated sorting).
IV.
Channels for Finding Manufacturers
First, trade shows (SWTest Asia, Annual Packaging & Testing Conference; Source: SWTest); second, industry associations (China Semiconductor Industry Association); third, packaging & testing plant directories (200–300 supporting enterprises; Source: Tianxia Gongchang); fourth, platforms (Alibaba, MIC); fifth, peer recommendations—Channels: Trade shows + associations + directories (first, identify the specific process stage).
V. Key Selection Criteria
1. Process (testing/probing/die bonding/temperature control); 2. Precision (micro/nano-scale); 3. Throughput (UPH); 4. Compatibility (chip types); 5. Software (ATE software)—Selection focus: Process + Precision + Throughput (submit samples for testing first).
VI. Supplier Evaluation
1. Installed base (9,000 units; Source: Huafeng Test & Control);
2. Market share (>60%; Source: EEFocus); 3. Case studies (top three OSATs); 4. Customization (non-standard equipment capabilities); 5. After-sales support (local service)—Evaluation focus: Installed base + Market share + Case studies (prioritize import substitution).
VII. Procurement Recommendations
1. Analog testing: Huafeng Test & Control; 2. Packaging/Soldering: Quick; 3. Probe cards: Mixin/Huaxi; 4. Tri-temp testing: Hanwang;
5. Acceptance: Actual measurement of precision and yield—Non-standard semiconductor packaging & testing equipment: Huafeng (testing), Quick (packaging), Hanwang (temperature control) (select vendors based on process stage; prioritize installed base and case studies).
